A Cu based functionally graded coating (FGC) has been deposited on an annealed Cu substrate by galvanostatic pulse reverse electrodeposition (PRED) route. The objective is to develop a hard surface with highly ductile and conductive interior. The cathodic current density (CCD) has been increased stepwise (from 50 to 200 mA/cm2) to synthesize Cu FGC on an annealed Cu substrate. It has three layers of Cu coating (20 μm each) with a gradual reduction in crystallite size along the thickness. Two layers of Cu-SiC nanocomposite coating with an increment in the amount of incorporated SiC nanoparticles (from 2 to 7 vol%) are electrodeposited on Cu FGC. This is done by introducing bath agitation (350 and 450 rpm) during deposition at CCD of 200 mA/cm2, which has resulted in Cu, Cu-SiC FGC with five layers (12 μm each). SiC nanoparticles are used to impart hardness to the coating through dispersion strengthening. The Cu, Cu-SiC FGC possesses higher hardness (∼3.8 GPa), lower residual compressive stress (∼291 MPa), and lower surface roughness (∼0.9 μm) as compared to electrodeposited single layer Cu-SiC nanocomposite coating. With such properties Cu, Cu-SiC FGC on annealed Cu substrate can serve as a novel prospective electrical contact material. © 2018 Elsevier B.V.