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Self-encapsulated DC MEMS switch using recessed cantilever beam and anodic bonding between silicon and glass
B. Behera, , G. Singh, S. Chandra
Published in Springer Science and Business Media Deutschland GmbH
Volume: 27
Issue: 3
Pages: 863 - 869
In the present work, we report design, fabrication and testing of a novel DC MEMS switch incorporating a self-encapsulated and recessed micro-cantilever beam. Wafer level anodic bonding with press-on contacts between silicon and glass is used innovatively to secure the recessed cantilever beam from one side. The cantilever is made of single crystal silicon in a recessed cavity whereas actuating electrode and signal lines are formed on corning glass. Anodic bonding provides “press on contacts” between silicon and glass plate and also secures the cantilever beam in the recessed cavity in silicon. The signal lines and pull-in electrode are formed on the glass plate using aluminium metallization while the cantilever has a gold pad at its tip. The anodic bonding provides three major advantages (i) it encapsulates the fragile beam and thus protects it from damage during dicing and packaging process (ii) it provides press-on contact between signal lines on glass plate and bonding pads on silicon (iii) it makes the beam optically visible. The devices were simulated using COMSOL multiphysics software and the results were compared with experimentally measured values. The cantilever based switch operates at low actuation voltage (average ~ 12 V) indicating that it can be used for power electronic circuits and various other applications. © 2020, Springer-Verlag GmbH Germany, part of Springer Nature.
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PublisherData powered by TypesetSpringer Science and Business Media Deutschland GmbH