This paper presents a novel process scheme for singulating Micro Electro Mechanical Systems (MEMS) or CMOS devices that may be released or unreleased, which have fragile components and/ or that have within or without in-plane structures. The process comprises spin coating of a polymer based protection material on the back and front of the device wafer, after attaching it to holder wafer. Such protected wafers are then singulated into individual chips using standard dicing saw. The process details, its advantages and results are elaborated. © 2005 IEEE.