This paper presents a novel process scheme for singulating Micro Electro Mechanical Systems (MEMS) or CMOS devices that may be released or unreleased, which have fragile components and/ or that have within or without in-plane structures. The process comprises spin coating of a polymer based protection material on the back and front of the device wafer, after attaching it to holder wafer. Such protected wafers are then singulated into individual chips using standard dicing saw. The process details, its advantages and results are elaborated. © 2005 IEEE.

Ajay Agrawal

Department of Electrical Engineering

IIT Jodhpur

S. Mohanraj

C.S. Premachandran

J. Singh

&ldquo;IIT Jodhpur is committed to impart quality education to facilitate the creation of qualified, competent and responsible human resources to meet the emerging technological challenges of the world. It is working towards creating an equitable learning platform that is positive, accessible and effective in the face of the modern societal and scientific advancements.

Flexibility in curriculum, in all its academic programs, encompassing elements of teaching, research, creativity, innovation and entrepreneurship is the most unique feature of IIT Jodhpur. The Department of Science and Technology (DST), under the National Mission on Cyber Physical Systems, has identified IIT Jodhpur as a Technology &amp; Innovation Hub in the area of Augmented Reality and Virtual Reality. The institute has also been nominated as the coordinator for the Jodhpur City and Knowledge Cluster by the Office of Principal Scientific Adviser, Government of India.

The sprawling 852-acre IIT Jodhpur campus is a majestic tribute to the deep-rooted diverse cultural heritage of the region. The campus is an architectural masterpiece, which is slated to become an international exemplar of sustainability with net-zero energy, and advanced water and waste management strategies.&rdquo;