This paper communicates stabilization of a Sn anode by impregnating it within the porous framework of a Ni-scaffold. The impregnation is carried out by electrodeposition Sn on Ni-foam followed by heating at 300 °C for 1 h. The Ni-foam was also electrodeposited on a Cu foil prior to deposition of Sn. The melting step leads to the formation of Ni–Sn and Cu–Sn intermetallics within pores of the Ni-scaffold. Sn–Cu/Ni intermetallics lithiate following the active-inactive strategy in which the inactive Cu/Ni buffers the volume expansion while Sn lithiates. Furthermore, this entire process takes place within Ni-scaffold which resists material pulverization and delamination and provide better electronic pathway for charge transfer. This active-inactive Sn:Sn–Cu/Ni intermetallic within a protected Ni-scaffold assembly results in 100 th cycle discharge capacity of 587.9 mA h/g at a rate of 500 mA/g (0.5 C), and superior rate capability delivering 463 mAh/g at a rate of 2 A/g (2 C) while retaining structural integrity as compared to pure Sn electrodeposited (without heat-treatment) on the nickel scaffold. © 2018 Elsevier B.V.