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Low temperature epoxy bonding for RF MEMS capacitive switch
Anuroop, D. Bansal, P. Kumar, A. Kumar, Khushbu,
Published in Springer Verlag
Volume: 25
Issue: 8
Pages: 3047 - 3051
Packaging is one of the most critical tasks for MEMS devices. Unlike solid state devices, MEMS structures involves moving structures which needs to be protected from outer environment ensuring free movement of the structure. In the present paper, inverted silicon cavity is used for capping the MEMS devices. However, in case of RF MEMS, silicon cavity would add parasitics and affects its electrical performance. Enclosing the MEMS structure, its mechanical response will also alter. The electrical as well as mechanical characteristics of the RF MEMS switch are analyzed using finite element method simulations. The electrical response of the fabricated switch after packaging is compared with unpackaged device. © 2018, Springer-Verlag GmbH Germany, part of Springer Nature.
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