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High Efficiency Coupling of Optical Fibres with SU8 Micro-droplet Using Laser Welding Process
S. Yardi, , P. Sundriyal, G. Bhatt, R. Kant, D. Boolchandani, S. Bhattacharya
Published in Springer US
Volume: 3
Issue: 3
Pages: 141 - 157
Apart from micro- structure fabrication, ablation, lithography etc., lasers find a lot of utility in various areas like precision joining, device fabrication, local heat delivery for surface texturing and local change of microstructure fabrication of standalone optical micro-devices (like microspheres, micro-prisms, micro-scale ring resonators, optical switches etc). There is a wide utility of such systems in chemical/ biochemical diagnostics and also communications where the standalone optical devices exist at a commercial scale but chip based devices with printed optics are necessary due to coupling issues between printed structures and external optics. This paper demonstrates a novel fabrication strategy used to join standalone optical fibres to microchip based printed optics using a simple SU8 drop. The fabrication process is deployed for fiber to fiber optical coupling and coupling between fiber and printed SU-8 waveguides. A CO2 laser is used to locally heat the coupling made up of SU8 material. Optimization of various dimensional parameters using design of experiments (DOE) on the bonded assembly has been performed as a function of laser power, speed, cycle control, spot size so on so forth. Exclusive optical [RF] modelling has been performed to estimate the transmissibility of the optical fibers bonded to each other on a surface with SU8. Our studies indicate the formation of a Whispering gallery mode (WGM) across the micro-droplet leading to high transmissibility of the signal. Through this work we have thus been able to develop a method of fabrication for optical coupling of standalone fibers or coupling of on-chip optics with off-chip illumination/detection. © 2016, Springer Science+Business Media New York.
About the journal
JournalData powered by TypesetLasers in Manufacturing and Materials Processing
PublisherData powered by TypesetSpringer US