In this paper, we present a gas sensor platform technology which is non-MEMS and doesn't require any complex packaging for example hanging the chips in air while packing to reduce the power consumption. Our work is based on changing the substrate material to borofloat glass, which has much lower thermal conductivity in comparison to silicon and alumina, hence reducing the thermal losses making it possible to operate the device even with lower power consumption. The presented process has lesser complexities and the process cost is certainly reduced, as it does not require thermal oxidation and bulk micromachining. Different substrates (silicon, alumina and glass) have been simulated using COMSOL to depict the benefit of lower thermal conductivity. Fabricated gas sensor platform is rugged and reliable; the same has been verified by maximum temperature test, long term ON test and ON-OFF pulse test. © 2018 IEEE.