This paper presents an analysis of jitter in a CMOS inverter due to power supply, ground bounce and substrate noise. The analysis is based on the recently introduced method EMPSIJ [1] which is extended in this paper for substrate noise induced jitter. To estimate jitter due to various noise sources (such as supply noise, ground bounce, substrate noise), noise transfer functions are derived. The results of EMPSIJ and the EDA simulations are compared for an inverter designed in a 28nm CMOS Technology of TSMC. For multiple test cases, the results match reasonably well with mean percentage error (MPE) not exceeding 10%. © 2018 IEEE.

Jai Narayan Tripathi

Department of Electrical Engineering

IIT Jodhpur

V.K. Sharma

H. Shrimali

&ldquo;IIT Jodhpur is committed to impart quality education to facilitate the creation of qualified, competent and responsible human resources to meet the emerging technological challenges of the world. It is working towards creating an equitable learning platform that is positive, accessible and effective in the face of the modern societal and scientific advancements.

Flexibility in curriculum, in all its academic programs, encompassing elements of teaching, research, creativity, innovation and entrepreneurship is the most unique feature of IIT Jodhpur. The Department of Science and Technology (DST), under the National Mission on Cyber Physical Systems, has identified IIT Jodhpur as a Technology &amp; Innovation Hub in the area of Augmented Reality and Virtual Reality. The institute has also been nominated as the coordinator for the Jodhpur City and Knowledge Cluster by the Office of Principal Scientific Adviser, Government of India.

The sprawling 852-acre IIT Jodhpur campus is a majestic tribute to the deep-rooted diverse cultural heritage of the region. The campus is an architectural masterpiece, which is slated to become an international exemplar of sustainability with net-zero energy, and advanced water and waste management strategies.&rdquo;

Journal	Data powered by TypesetIEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2018
Publisher	Data powered by TypesetInstitute of Electrical and Electronics Engineers Inc.