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Design of vertical packaging technology for RF MEMS switch
D. Bansal, A. Sharma, M. Kaur,
Published in SPIE
Volume: 8549
Wafer-level micro-encapsulation is an innovative, low-cost, wafer-level packaging method for encapsulating RF MEMS switches. This article presents an approach for design and processing steps related to encapsulation of individual RF components e.g. CPW, RF MEMS switches, in view of the variation in performance subsequent to packaging. Bottom contact vertical packaging is more prone to misalignment margin and easy to make connections. Cavity height of 30 μm is optimized for bottom contact vertical packaging. © 2012 SPIE.
About the journal
JournalData powered by TypesetProceedings of SPIE - The International Society for Optical Engineering
PublisherData powered by TypesetSPIE