In this paper, a design of broadband planar substrate integrated waveguide (SIW) transvar coupler is demonstrated. A study has been carried out to explore the effects of the number and size of coupling apertures, placed in the side wall of the four port coupler, on its performance. A design curve is also formulated to relate the bandwidth performance of the coupler with the number of apertures. Finally a six aperture coupler has been designed and fabricated to validate the simulation results. The proposed coupler is a good candidate for circular polarized antenna feeding network. © 2015 IEEE.

Soumava Mukherjee

Department of Electrical Engineering

IIT Jodhpur

R. Srivastava

A. Biswas

&ldquo;IIT Jodhpur is committed to impart quality education to facilitate the creation of qualified, competent and responsible human resources to meet the emerging technological challenges of the world. It is working towards creating an equitable learning platform that is positive, accessible and effective in the face of the modern societal and scientific advancements.

Flexibility in curriculum, in all its academic programs, encompassing elements of teaching, research, creativity, innovation and entrepreneurship is the most unique feature of IIT Jodhpur. The Department of Science and Technology (DST), under the National Mission on Cyber Physical Systems, has identified IIT Jodhpur as a Technology &amp; Innovation Hub in the area of Augmented Reality and Virtual Reality. The institute has also been nominated as the coordinator for the Jodhpur City and Knowledge Cluster by the Office of Principal Scientific Adviser, Government of India.

The sprawling 852-acre IIT Jodhpur campus is a majestic tribute to the deep-rooted diverse cultural heritage of the region. The campus is an architectural masterpiece, which is slated to become an international exemplar of sustainability with net-zero energy, and advanced water and waste management strategies.&rdquo;

Journal	Data powered by TypesetIEEE Antennas and Propagation Society, AP-S International Symposium (Digest)
Publisher	Data powered by TypesetInstitute of Electrical and Electronics Engineers Inc.
ISSN	15223965