This paper presents design and fabrication of MEMS 1-D micro mirror using thermally actuated bimorph actuator, for out of plane actuation application. Bimorph actuator was made of aluminum and silicon dioxide materials. Micro mirror performance was simulated using COMSOL multiphysics tool. Maximum displacement and temperature profile with voltage along micro mirror were presented. Aluminum was used as heater element as well as top layer of bimorph layer. Micro mirror was successfully released using surface micromachining with copper as sacrificial layer. © 2018 IEEE.

Ajay Agrawal

Department of Electrical Engineering

IIT Jodhpur

V. Maharshi

V. Mere

&ldquo;IIT Jodhpur is committed to impart quality education to facilitate the creation of qualified, competent and responsible human resources to meet the emerging technological challenges of the world. It is working towards creating an equitable learning platform that is positive, accessible and effective in the face of the modern societal and scientific advancements.

Flexibility in curriculum, in all its academic programs, encompassing elements of teaching, research, creativity, innovation and entrepreneurship is the most unique feature of IIT Jodhpur. The Department of Science and Technology (DST), under the National Mission on Cyber Physical Systems, has identified IIT Jodhpur as a Technology &amp; Innovation Hub in the area of Augmented Reality and Virtual Reality. The institute has also been nominated as the coordinator for the Jodhpur City and Knowledge Cluster by the Office of Principal Scientific Adviser, Government of India.

The sprawling 852-acre IIT Jodhpur campus is a majestic tribute to the deep-rooted diverse cultural heritage of the region. The campus is an architectural masterpiece, which is slated to become an international exemplar of sustainability with net-zero energy, and advanced water and waste management strategies.&rdquo;

Journal	Data powered by TypesetProceedings of International Conference on 2018 IEEE Electron Device Kolkata Conference, EDKCON 2018
Publisher	Data powered by TypesetInstitute of Electrical and Electronics Engineers Inc.