An analysis of power supply induced jitter in a high speed serial link is presented in this paper. An equivalent reduced model for serial link is used for the analysis. Jitter induced by the ripples in power delivery network is analyzed by a small signal equivalent model. The effect is modeled by a transfer function which is not technology specific and can be used generically for System-On-Chip (SoC) level design considerations. The analysis is supported by experimental results by simulation in 130nm BiCMoS RF technology and 28nm FDSOI technology (both technologies are of STMicroelectronics). © 2015 IEEE.

Jai Narayan Tripathi

Department of Electrical Engineering

IIT Jodhpur

H. Advani

R.K. Nagpal

V.K. Sharma

R. Malik

&ldquo;IIT Jodhpur is committed to impart quality education to facilitate the creation of qualified, competent and responsible human resources to meet the emerging technological challenges of the world. It is working towards creating an equitable learning platform that is positive, accessible and effective in the face of the modern societal and scientific advancements.

Flexibility in curriculum, in all its academic programs, encompassing elements of teaching, research, creativity, innovation and entrepreneurship is the most unique feature of IIT Jodhpur. The Department of Science and Technology (DST), under the National Mission on Cyber Physical Systems, has identified IIT Jodhpur as a Technology &amp; Innovation Hub in the area of Augmented Reality and Virtual Reality. The institute has also been nominated as the coordinator for the Jodhpur City and Knowledge Cluster by the Office of Principal Scientific Adviser, Government of India.

The sprawling 852-acre IIT Jodhpur campus is a majestic tribute to the deep-rooted diverse cultural heritage of the region. The campus is an architectural masterpiece, which is slated to become an international exemplar of sustainability with net-zero energy, and advanced water and waste management strategies.&rdquo;

Journal	Data powered by TypesetInternational System on Chip Conference
Publisher	Data powered by TypesetIEEE Computer Society
ISSN	21641676