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A process technique to engineer the stress of thick doped polysilicon films for MEMS applications
, R. Nagarajan, J. Singh
Published in Institute of Electrical and Electronics Engineers Inc.
Volume: 2002-January
Pages: 207 - 211
It is shown that the LPCVD deposition technique and annealing of polysilicon effect the mechanical properties of the released structures, for micromachined sensors. Tensile residual stress is often required for a stable polysilicon MEMS structure after final release process. © 2002 IEEE.