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A case study of BGA package for high speed channel with non-ideal ground induced resonance conditions
V.K. Singh, R.K. Nagpal,
Published in Institute of Electrical and Electronics Engineers Inc.
Pages: 69 - 72
Proper transmission of high speed signal requires sufficiently high bandwidth of the medium. The reference planes play a vital role in achieving distortion-free signal propagation. In this paper a BGA package design exhibiting resonance conditions in insertion loss is analyzed. Analysis led to ground path issues caused by return current density congestions. Improvement in ground return path layout led to elimination of resonance conditions. Re-designed package is meeting the intended design target for HDMI 2.0 standards. © 2014 IEEE.